1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations.
Product Details
- Published:
- 12/01/2013
- Number of Pages:
- 4
- File Size:
- 1 file , 88 KB
