1.1 This test method covers the determination of the volume resistivity of resin-based conductive adhesives in the cured condition. The test is made on a thin adhesive layer as prepared in a bonded specimen. This test method is used for conductive adhesives that are cured either at room temperature or at elevated temperatures.
Product Details
- Published:
- 11/01/2017
- Number of Pages:
- 3
- File Size:
- 1 file , 93 KB
