1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
Product Details
- Published:
- 11/01/2012
- Number of Pages:
- 9
- File Size:
- 1 file , 130 KB
- Redline File Size:
- 2 files , 290 KB
