Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.
Product Details
- Published:
- 04/30/1980
- ISBN(s):
- 0580112659
- Number of Pages:
- 2
- File Size:
- 1 file , 290 KB
- Product Code(s):
- 00027795, 00027795, 00027795
